CLICK TH ELINKS BELOW
1. 1206 Installation
2. SOIC 14 Installation
3. 0805 Installation
4. 0402 Installation
5. BGA Site Preparation
6. Pad Preparation
7. TSOP32 Installation Multi-lead Method
8. TSOP32 Installation Drag Method
9. Chip Component Prep--Bump Tack Method
10. Chip Component Prep--Dry Tack Method
11. MELF Removal
12. PCB Corner Repair
13. Plated Through Hole Repairs of PCBs
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